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A705
www.addmtek.com DESCRIPTION The A705 is a low dropout current regulator rated for 210mA, 230mA, 250mA, 270mA, and 290mA constant sink current. The low quiescent current and low dropout voltage are achieved by advanced Bi-CMOS process.
200mA ~ 300mA ADVANCED CURRENT REGULATOR
FEATURES Only bypass capacitor is required. 210/230/250/270/290mA constant sink current. Output short / open circuit protection. Low dropout voltage. Low quiescent current. Supply voltage range 2.7V ~ 12V. 2KV HBM ESD protection. Advanced Bi-CMOS process. SOT-89 and TO-252 package available.
TYPICAL APPLICATION CIRCUIT
V LED+
APPLICATIONS
Power LED Driver LED Cap-Lamp
C BP
PACKAGE PIN OUT
VDD
VDD
OUT
GND OUT SOT-89 (Top View) TO-252
GND OUT
V DD C IN
VDD
A705X
GND
ORDER INFORMATION Output Current 200mA ~ 220mA 220mA ~ 240mA 240mA ~ 260mA 260mA ~ 280mA 280mA ~ 300mA
N
SOT-89 3-pin A705NFT-210 A705NFT-230 A705NFT-250 A705NFT-270 A705NFT-290
S
TO-252 3-pin A705SFT-210 A705SFT-230 A705SFT-250 A705SFT-270 A705SFT-290
Note: The letter "F" is marked for Lead Free process, and letter "T" is marked for Tape & Reel.
Copyright (c) 2007 ADDtek Corp.
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ABSOLUTE MAXIMUM RATINGS (Note) Input Voltage, VDD Output Voltage, VOUT Maximum Junction Temperature, TJ Storage Temperature Range Lead Temperature (Soldering, 10 seconds)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal.
-0.3V to 13.2V -0.3V to 17V 150C -40C to 150C 260C
BLOCK DIAGRAM
A705
VDD Band-gap Reference Control Circuit
OUT
GND
PIN DESCRIPTION Pin Name VDD OUT GND Pin Function Power supply. Output pins. Connected to load. Ground. THERMAL RESISTANCE Package N S SOT-89 TO-252 JT (C /W) 35 7
Note: TJ = TC + (PD x JT) JT: Thermal Resistance - Junction to Tab. TC: Case (Tab) Temperature. TJ: Junction Temperature. PD: Power Consumption.
Copyright (c) 2007 ADDtek Corp.
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RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Output Sink Current Operating Free-air Temperature Range Symbol VDD IOUT TA Min 2.7 -40 Typ Max 12 260 +85 Unit V mA C
DC ELECTRICAL CHARACTERISTICS VDD=3.7V, TA=25C, No Load (Unless otherwise noted) Parameter Symbol Condition A705P A705Q Output Sink Current IOUT VOUT=0.2V A705R A705S A705T Load Regulation Line Regulation Output Dropout Voltage (Note) Supply Current Consumption VOUTL IDD VOUT=0.2V to 3V VDD= 3V to 12V, VOUT=0.2V 120 200 Min 200 220 240 260 280 Typ 210 230 250 270 290 Max 220 240 260 280 300 2 2 mA/V mA/V mV uA VDD OUT mA Unit Apply Pin
Note: Output dropout voltage: 90% x IOUT @ VOUT=200mV
Copyright (c) 2007 ADDtek Corp.
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APPLICATION INFORMATION
The Maximum Power Dissipation on Regulator: PD(MAX) = VOUT(MAX) x IOUT(NOM) + VIN(MAX) x IQ
VOUT(MAX) = the maximum voltage on output pin; IOUT(NOM) = the nominal output current; IQ = the quiescent current the regulator consumes at IOUT(MAX); VIN(MAX) = the maximum input voltage.
Thermal Consideration:
The A705 has internal power and thermal limiting circuitry designed to protect the device under overload conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load conditions. The thermal protection circuit of A705 prevents the device from damage due to excessive power dissipation. When the device temperature rises to approximately 150C, the regulator will be turned off. When power consumption is over about 700mW (SOT-89 package, at TA=70C) or 1000mW (TO-252 package, at TA=70C), additional heat sink is required to control the junction temperature below 120C. The junction temperature is:
TJ = PD (JT +CS +SA ) + TA
PD : Dissipated power. JT : Thermal resistance from the junction to the mounting tab of the package. CS : Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically, CS < 1.0C /W) SA : Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through-hole vias. PCB SA (C /W) PCB heat sink size (mm )
2
59 500
45 1000
38 1500
33 2000
27 3000
24 4000
21 5000
Copyright (c) 2007 ADDtek Corp.
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PACKAGE
Top Marking for SOT-89
X : Output Current Options
A705X YWWVV
P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA Y : Year Code WW : Week Code V : Vendor Code
3-Pin Surface Mount SOT-89
INCHES MIN TYP MAX 0.181 0.102 0.063 0.017 0.090 0.019 MILLIMETERS MIN 4.39 2.28 1.39 0.38 2.13 0.33 TYP 1.49 BSC 2.99 BSC 0.45 3.94 1.70 0 0.89 0.55 4.24 1.82 8 1.19 MAX 4.59 2.59 1.60 0.43 2.28 0.48
A L
C D
A B
0.173 0.090
C 0.055 D 0.015
K N F J G H
B
E
E F
0.084 0.016
M
G H J K L M
0.059 BSC 0.118 BSC 0.018 0.155 0.067 0 0.022 0.167 0.072 8 0.047
N 0.035
Copyright (c) 2007 ADDtek Corp.
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Top Marking for TO-252
X : Output Current Options
A705X YWWVV LLLLL.L
P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA Y : Year Code WW : Week Code V : Vendor Code LLLLL.L : Lot Number
3-Pin Surface Mount TO-252
INCHES
E b2 L2
SEATING PLAN
MILLIMETERS MAX 0.094 0.050 0.215 0.023 0.023 0.220 0.265 MIN 2.18 1.02 5.21 0.46 0.46 5.33 6.35 TYP 0.61 2.29 BSC 4.58 BSC 9.40 0.51 0.64 1.52 10.41 1.02 2.03 MAX 2.39 1.27 5.46 0.58 0.58 5.59 6.73
A A1 c1
MIN A 0.086
TYP 0.024 -
A1 0.040 b -
b2 0.205
D H
c
0.018
c1 0.018 D 0.210
L1 b e1 L
E
e c
0.250
e e1
0.090 BSC 0.180 BSC 0.410 0.040 0.080
H 0.370 L 0.020
L1 0.025 L2 0.060
Copyright (c) 2007 ADDtek Corp.
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IMPORTANT NOTICE
ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer's applications, the customer should provide adequate design and operating safeguards. ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of its products to the specifications applicable at the time of sale.
ADDtek Corp. 9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105 TEL: 2-25700299 FAX: 2-25700196
Copyright (c) 2007 ADDtek Corp.
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